TO-220 - Wikipedia
The TO-220 is a style of electronic package used for high-powered, through-hole components with 0.1 inches (2.54 mm) pin spacing. The "TO" designation stands for "transistor outline". [2] TO-220 packages have three leads. Similar packages with …
TO-220 - Toshiba Electronic Devices & Storage Corporation
On this page you can find the dimensions and packing method for Toshiba Semiconductor's TO-220 package.
MOSFETs - TO-220 and TO-220AB package - Vishay Intertechnology
TO-220 and TO-220AB package, MOSFETs manufactured by Vishay, a global leader for semiconductors and passive electronic components.
(8) Outline conforms to JEDEC® TO-220, except A2 (maximum) and D2 (minimum) where dimensions are derived from the actual package outline SYMBOL MILLIMETERS INCHES NOTES SYMBOL MILLIMETERS INCHES NOTES MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. A 4.25 4.65 0.167 0.183 D2 11.68 12.88 0.460 0.507 6 A1 1.14 1.40 0.045 0.055 E 10.11 …
TO-220 Package
The TO-220 is a type of plastic-molded package that features a flat metal tab at its back (see Figure 1) to enable it to dissipate relatively large amounts of heat. The TO-220 is commonly used for housing transistors, thyristors, and integrated circuits with low lead counts.
Transistor Outline (TO) Package Types
Transistor Outline (TO) Package Types The transistor outline (TO) package family consists of many types of packaging solutions for transistors and similar discrete devices as well as simple IC's with low pin counts.
Complete Guide to TO-220 Transistor Pinout and Configuration
By addressing these common pitfalls and understanding the troubleshooting steps outlined here, you can enhance the reliability and effectiveness of your circuit designs using components housed in a TO-220 package.
What is Transistor Outline (TO)? - Electrical Information
TO-220 is an insertion-mount package with a lead pitch of 2.54mm. TO-220 has a metal tab for mounting on a heat sink. TO-220 has screw holes at the top of the package so that it can be screwed to a heat sink. Therefore, TO-220 is used for components that dissipate relatively large amounts of heat.
For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Microchip Technology Drawing C04-034-AB Rev C Sheet 2 of 2 3-Lead Transistor Outline Package (AB) - [TO-220] e N 2.54 BSC 3 Units Dimension Limits MILLIMETERS MIN NOM MAX Mounting Hole Diameter Terminal ...
(8) Outline conforms to JEDEC TO-220, except A2 (maximum) and D2 (minimum) where dimensions are derived from the actual package outline SYMBOL MILLIMETERS INCHES NOTES SYMBOL MILLIMETERS INCHES NOTES MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. A 4.25 4.65 0.167 0.183 D2 11.68 12.88 0.460 0.507 6 A1 1.14 1.40 0.045 0.055 E 10.11 …
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