Researchers can now fabricate a 3D chip with alternating layers of semiconducting material grown directly on top of each other. The method eliminates thick silicon substrates between the layers, ...
Alphawave Semi is positioned to pioneer this effort with an HBM4 memory controller portfolio and recently announced 3nm, 24 Gbps die-to-die UCIe IP subsystem delivering 1.6 TB/s of bandwidth. In ...