The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of ...

The Commerce Department has awarded $1.2 billion to two ASU-related projects and facilities tied to the way semiconductors ...

Taiwan took another step in enhancing its key role in the production of advanced semiconductor chips used for artificial ...

Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S.

The Advanced Semiconductor Packaging market is experiencing growth, driven by the increasing demand for high-performance Electronics across various sectors. GERMAN, GERMAN, UNITED KINGDOM ...

Nvidia CEO Jensen Huang confirms changes in advanced packaging needs at TSMC, opting for CoWoS-L over CoWoS-S for upcoming ...

Operations are scheduled to start in 2026 with the expansion of packaging capacity beginning in 2027. Read more at ...

advanced packaging technology offered by Taiwan Semiconductor Manufacturing Co (TSMC), Nvidia's main contract chipmaker. "As we move into Blackwell, we will use largely CoWoS-L. Of course ...

NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

Singapore can be expected to play a larger role in developing complex artificial intelligence (AI) applications when Micron's ...